Senior R&D Engineer for Packaging & Testing
Position Code: 24030606
Responsibilities:
Conduct feasibility analysis and timeline management for high voltage/high-power semiconductor packaging and testing.
Build/operate test platforms to perform:
Microstructural measurements
Electrical parameter validation
Failure characterization
Reliability/aging tests
Application-specific equivalent testing
Design test plans, hardware, and software protocols.
Develop/maintain technical specifications:
Design standards, test methods, packaging guidelines
SOPs for packaging/testing processes
Coordinate with suppliers for process control, failure analysis, and quality enhancement.
Analyze wafer sort (CP)/final test (FT) data, generate yield reports, and implement process improvements.
Qualifications:
Bachelor’s+ degree in Microelectronics/Power Electronics/IC Engineering.
Knowledge of semiconductor packaging materials/methods; 5+ years relevant experience.
2+ years specialized experience in power device testing/packaging.
Proficiency in:
Power semiconductor principles
Reliability/aging test procedures
Engineering test equipment operation
Skilled with at least one data analysis tool (JMP/Minitab/Origin).
CET-6+ English proficiency; fluent technical documentation reading.
Essential attributes:
Detail-oriented and methodical work style
Strong execution and problem-solving capabilities
Team collaboration and accountability
Application:
Submit materials to: eiri-hr@tsinghua.edu.cn
Email Subject:
"Energy Internet Research Institute, Tsinghua University + Senior Packaging & Testing Engineer + [Your Name]"
Energy Internet Research Institute, Tsinghua University sincerely looks forward to your joining us!
